A structural adhesive curing agent is the component that decides whether a bonded joint holds at 80 °C or creeps apart. Yolatech supplies three amine types for that job: HTDA, MXDA, and DACH. Each one trades cure speed against heat resistance and pot life. All three cure fully at room temperature.
Three things, in this order: room-temperature cure, high glass transition temperature in the cured network, and a workable pot life. Those pull against each other. Fast cure usually means short pot life, and high Tg usually means brittle.
Alicyclic amines resolve the conflict better than aliphatic ones. The ring adds stiffness for heat resistance without the yellowing that aromatic amines bring, and the saturated backbone resists oxidation over time.
| Product | CAS | Purity (%) | Key figure |
| HTDA | 13897-55-7 | ≥99.0 | Amine value 820–900 mg KOH/g |
| MXDA | 1477-55-0 | ≥99.0 | Water ≤0.50 % |
| DACH | 694-83-7 | ≥99.0 | AHEW 28.5 g/eq |
HTDA is a cis/trans isomer mixture that stays liquid at room temperature. Its moisture content is capped at 0.1 %, which is tighter than MXDA at 0.5 % — that matters in an adhesive because water competes with the amine for epoxy groups and leaves a weaker joint.
MXDA is a xylylenediamine with an aromatic ring and aliphatic amine groups. It cures at room temperature and is widely used where you need faster development of strength. It yellows on prolonged air exposure, so it suits pigmented or hidden bond lines more than clear ones.
DACH is the reference point for calculations because its AHEW is published. At 28.5 g/eq against a 185 g/eq resin, the stoichiometric load is 28.5 ÷ 185 × 100 = 15.4 phr.
Amine dosage always follows amine hydrogen equivalent weight divided by epoxy equivalent weight, times one hundred. Get that number first, then adjust down 5–10 % if the joint needs more flexibility.
Running below stoichiometric leaves epoxy groups unreacted; running far above it leaves free amine that attracts moisture. Both show up as a joint that fails in humid service. Confirm the final figure against our TDS before production.
For a general structural adhesive at room temperature, start with DACH — its published AHEW makes formulation predictable. Move to HTDA when the joint sees heat or chemical exposure, and to MXDA when cure speed matters more than colour stability. Whichever structural adhesive curing agent you land on, calculate the ratio before you scale the batch.
HTDA CAS 13897-55-7 — full specification, DACH CAS 694-83-7 with AHEW data, and MXDA CAS 1477-55-0. Tell us your cure temperature and target Tg and we will narrow the choice down.
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